CSEAC 2026 – The 14th Semiconductor Equipment Materials and Core Parts Exhibition

CSEAC 2026 – The 14th Semiconductor Equipment Materials and Core Parts Exhibition

China’s Premier Platform for Semiconductor Innovation, Sourcing & Global Industry Collaboration

Event Overview

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About CSEAC 2026

CSEAC is the largest and most influential annual trade fair for the semiconductor equipment, materials, and core parts industry in China. Now in its 14th edition, this world-class exhibition serves as the ultimate gateway to the world’s fastest-growing semiconductor market — China.

Over the years, CSEAC has brought together industry experts, researchers, exhibitors, and professional visitors, building a strong reputation for professionalism, industry influence, and high-quality resources. With the aim of “Professionalism, Industrialization and Internationalization,” CSEAC provides a friendly and cooperative platform for the domestic and international semiconductor industry to exchange technologies, conduct business negotiations, expand markets, and promote products.

The event brings together 1,300+ exhibitors, 15,000+ professional visitors, and features 20+ concurrent technical forums — making it the must-attend event for anyone serious about the semiconductor supply chain.

Why CSEAC 2026?

Industry-Based Excellence

Co-organized by the China Electronic Special Equipment Industry Association — a national-level industry authority — CSEAC carries authoritative industry tracking and professional positioning. You’re not just attending an expo; you’re stepping into the heart of China’s official semiconductor ecosystem.

Global Industry Gathering

Connect with 1,300+ exhibitors from all over the world and thousands of professional visitors, creating exceptional opportunities for supplier exposure and commercial exchange. The event attracts industry leaders from across the entire semiconductor value chain.

Complete Value Chain Coverage

From wafer manufacturing equipment and packaging/testing tools to core components, front-end materials, back-end materials, and plant facilities — the exhibition covers every segment of the semiconductor industry. One venue. One ticket. The entire ecosystem.

High-Level Concurrent Forums

20+ concurrent forums gathering industry leaders and authoritative experts. Topics include etching technology, thin-film deposition, advanced cleaning, measurement, bonding, AI in manufacturing, sovereign fabs, and much more. This is where the future of semiconductors gets discussed — and decided.

Industry-University-Research Integration

CSEAC bridges the gap between academia and industry with dedicated sessions on talent exchange, ecosystem activation, and commercialization of research. See how cutting-edge lab discoveries become fab-floor realities.

Talent & Ecosystem Activation

Special thematic roadshows on Human Resources and University-Industry-Research Collaboration — because great chips need great people. Connect with the next generation of semiconductor talent and shape the workforce of tomorrow.

Exclusive International Visitor Perk

Free admission to all paid technical sessions exclusively for overseas attendees. Simply present your international round-trip flight itinerary at the on-site registration desk, and we’ll upgrade your badge to include all premium sessions — at no extra cost. A genuine thank-you for traveling to join us.

Business Matchmaking & Networking

Meet decision-makers from wafer fabs, packaging & testing plants, equipment distributors, end-application manufacturers (automotive electronics, new energy, industrial control, communications/AIoT), core parts suppliers, and EMS providers. We don’t just bring you a crowd — we bring you the right people for your business goals.

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Key Products on Display

Wafer Manufacturing Equipment

Etching tools, thin-film deposition systems, lithography equipment, and wafer fabrication machinery.

Packaging & Testing Equipment

Advanced packaging tools, test handlers, probes, inspection systems, and assembly equipment.

Core Components & Consumables

Vacuum systems, RF power supplies, gas delivery systems, precision motion systems, and critical consumables.

Front-End Materials

Silicon wafers, photoresists, specialty gases, CMP slurries, wet chemicals, and photomasks.

Back-End Materials

Substrates, leadframes, encapsulants, molding compounds, and advanced packaging materials.

Semiconductor Displays

Display technologies, micro-LED, and related semiconductor display solutions.

Plant Facilities & Pollution Control

Cleanroom solutions, MEP systems, environmental control, and fab infrastructure.

Visitor Profile

• Wafer Manufacturing / Packaging & Testing Plants – Plant Managers, Equipment/Materials Purchasing Directors, Process/R&D Managers, Equipment Engineers

• Semiconductor Equipment / Materials Agents, Distributors, System Integrators – Company Owners, Purchasing Managers, Technical Support Managers

• Major End-Application Manufacturers – Automotive Electronics, New Energy/Industrial Control, Communications/AIoT

• Semiconductor Core Parts / Subsystem Manufacturers – Upstream component makers (vacuum, motion, gas, RF, test & measurement)

• Electronic Manufacturing Services (EMS) Providers – Packaging & Testing Equipment, Electronic Chemicals, Carrier/Substrate Materials

Concurrent Forums (20+ Sessions)

• 2026 China Electronic Special Equipment Industry Association Semiconductor Equipment Annual Conference

• Seminar on Etching Technology, Processes and Equipment

• Seminar on Thin-Film Deposition Technology, Processes and Equipment

• Seminar on Advanced Process Cleaning Technology and Equipment

• Seminar on Measurement Technology and Equipment

• Seminar on Advanced Bonding Technology, Processes and Equipment

• Seminar on the Development of Artificial Intelligence and Electronic Manufacturing Equipment

• Global Semiconductor CEO Forum

• Forum on the Phantomization of Semiconductor Equipment and Synergy among Core Parts

• New Product and Technology Launch

• Forum on New Devices and Processes Driving Innovation and Development of New Materials and Equipment

• Challenges of Industrial Robots in Smart Manufacturing

• Path to Sovereign Semiconductor Fab

• Human Resources: Thematic Roadshow on the Commercialization of University-Industry-Research Collaboration

• The 18th Integrated Circuit Packaging and Testing Industry Chain Innovation and Development Forum (CIPA 2026)

• Forum on Collaborative R&D in Advanced Packaging Technologies for the AI Era

• Forum on Innovation in Packaging and Testing Equipment and Materials

• Forum on Supply Chain Security and Cross-Industry Collaboration in the Packaging and Testing Market

• 2026 Forum on the Development of Integrated Circuit Equipment, Materials and Parts

• 2026 (the 5th) Semiconductor Ecosystem Innovation Conference

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Ready to plug into the heart of the semiconductor industry?

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Early-bird registration closes soon. Secure your badge and get exclusive access to the technical sessions.

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Quick Tips for Visitors

• Travel: Wuxi is easily accessible from Shanghai (30 minutes by high-speed train) and major Chinese cities. Plan your trip early.

• Accommodation: Book near Wuxi Taihu International Expo Center — hotels fill up fast during the event.

• Networking: Bring plenty of business cards. The matchmaking sessions are worth their weight in gold.

• International Visitors: Don’t forget to bring your round-trip flight itinerary to claim your free upgrade to all premium sessions at the on-site registration desk.

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CSEAC 2026 — Where the global semiconductor family meets. See you in Wuxi!